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Notes on Bonding
Note Sputter targets can be bonded by Indium Bonding, Copper Backing plates OR Elastomeric Bonding. Metallic bonds enable good electrical and thermal conductivity (Ensures heat is taken away from the target material). For low temperature applications, Indium works fine while for high temperature applications elastomeric bonding OR copper bonding/plating is the way to go. Please select the bonding option for more information.
Safety Data Sheet Download SDS
SKU: XL-1-1 Category:

Additional information

Elements

Aluminum (Al), Antimony (Sb), Barium (Ba), Bismuth (Bi), Boron (B), Cadmium (Cd), Calcium (Ca), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite (C), Hafnium (Hf), Holmium (Ho), Indium (In), Iridium (Ir), Iron (Fe), Lanthanum (La), Lead (Pb), Lithium (Li), Lutetium (Lu), Magnesium (Mg), Manganese (Mn), Molybdenum (Mo), Neodymium (Nd), Nickel (Ni), Niobium (Nb), Osmium (Os), Palladium (Pd), Platinum (Pt), Potassium (K), Praseodymium (Pr), Rhenium (Re), Rhodium (Rh), Rubidium (Rb), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), N-type Silicon (n-Si), P-type Silicon (p-Si), Undoped Silicon (i-Si), Silver (Ag), Strontium (Sr), Tantalum (Ta), Tellurium (Te), Terbium (Tb), Thulium (Tm), Tin (Sn), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zinc (Zn), Zirconium (Zr), Other, NA

Purity

99%, 99.5%, 99.9%, 99.99%, 99.999%

Diameter

2”, 3”, 4”, 5”, 6”, NA

Thickness

0.125”, 0.25”, NA

Bonding

Yes, No, NA

Other Shapes

Bars, Rods, Sheets, Flakes, Tubes, Wires

Dimensions

Dimensions