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Selenide Ceramics ST

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Safety Data SheetDownload SDS

Notes on Bonding
Note Sputter targets can be bonded by Indium Bonding, Copper Backing plates OR Elastomeric Bonding. Metallic bonds enable good electrical and thermal conductivity (Ensures heat is taken away from the target material). For low temperature applications, Indium works fine while for high temperature applications elastomeric bonding OR copper bonding/plating is the way to go. Please select the bonding option for more information.
SKU: XL-1-1-1-1-1-1-1-1-1-1-1 Category:

Additional information

Elements

Aluminum Selenide (Al2Se3), Antimony Triselenide (Sb2Se3), Arsenic Triselenide (As2Se3), Bismuth Selenide (Bi2Se3), Cadmium Selenide (CdSe), Chromium Selenide (CrSe), Copper Indium Gallium Selenide (CIGS), Copper Indium Selenide (CIS), Copper Zinc Tin Sulfide Selenide (CZTSSe), Copper Selenide (CuSe), Gallium Selenide (Ga2S3), Gemanium Selenide (GeSe), Germanium Selenide (GeSe2), Indium Selenide (In2Se3), Lead Selenide (PbSe), Manganese Selenide (MnSe), Molybdenum Diselenide (MoSe2), Niobium Diselenide (NbSe2), Tantalum Diselenide (TaSe2), Tin Selenide (SnSe), Titanium Selenide (TiSe2), Tungsten Diselenide (WSe2), Zinc Selenide (ZnSe), Other, NA

Purity

99%, 99.5%, 99.9%, 99.99%, 99.999%

Diameter

2”, 3”, 4”, 5”, 6”, NA

Thickness

0.125”, 0.25”, NA

Bonding

Yes, No, NA

Other Shapes

Bars, Rods, Sheets, Flakes, Tubes, Wires

Dimensions

Dimensions