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Telluride Ceramics ST

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Notes on Bonding
Note Sputter targets can be bonded by Indium Bonding, Copper Backing plates OR Elastomeric Bonding. Metallic bonds enable good electrical and thermal conductivity (Ensures heat is taken away from the target material). For low temperature applications, Indium works fine while for high temperature applications elastomeric bonding OR copper bonding/plating is the way to go. Please select the bonding option for more information.
SKU: XL-1-1-1-1-1-1-1-1-1-1-1-1 Category:

Additional information

Elements

Aluminum Telluride (Al2Te3), Antimony Telluride (Sb2Te3), Bismuth Telluride (Bi2Te3), Copper Zinc Telluride (CuZnTe), Copper Telluride (CuTe), Cadmium Telluride (CdTe), Gallium Telluride (Ga2Te3), Germanium Telluride (GeTe), Indium Telluride (In2Te3), Lead Telluride (PbTe), Lithium Telluride (Li2Te), Manganese Telluride (MnTe), Molybdenum Ditelluride (MoTe2), Niobium Telluride (NbTe2), Nickel Telluride (NiTe), Tantalum Telluride (TaTe2), Thulium Telluride (TmTe), Tin Telluride (SnTe), Tungsten Ditelluride (WTe2), Zinc Telluride (ZnTe)
Purity

99%, 99.5%, 99.9%, 99.99%, 99.999%
Diameter

2”, 3”, 4”, 5”, 6”
Thickness

0.125”, 0.25”
Bonding

Yes, No

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