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Boride Ceramics ST

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Safety Data SheetDownload SDS

Notes on Bonding
Note Sputter targets can be bonded by Indium Bonding, Copper Backing plates OR Elastomeric Bonding. Metallic bonds enable good electrical and thermal conductivity (Ensures heat is taken away from the target material). For low temperature applications, Indium works fine while for high temperature applications elastomeric bonding OR copper bonding/plating is the way to go. Please select the bonding option for more information.
SKU: XL-1-1-1-1-1-1-1-1-1-1 Category:

Additional information

Elements

Aluminum Diboride (AlB2), Cerium Hexaboride (CeB6), Chromium Boride (Cr5B3), Chromium Diboride (CrB2), Hafnium Diboride (HfB2), Iron Boride (FeB), Lanthanum Hexaboride (LaB6), Magnesium Diboride (MgB2), Molybdenum Boride (Mo2B), Neodymium Boride (NdB6), Niobium Diboride (NbB2), Molydenum Boride (Mo2B5), Nickel Boride (Ni2B), Tantalum Boride (TaB2), Titanium Diboride (TiB2), Tungsten Boride (WB), Tungsten Diboride (WB2), Vanadium Boride (VB2), Zirconium Diboride (ZrB2)
Purity

99%, 99.5%, 99.9%, 99.99%, 99.999%
Diameter

2”, 3”, 4”, 5”, 6”
Thickness

0.125”, 0.25”
Bonding

Yes, No

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