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Sulfide Ceramics ST

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Safety Data SheetDownload SDS

Notes on Bonding
Note Sputter targets can be bonded by Indium Bonding, Copper Backing plates OR Elastomeric Bonding. Metallic bonds enable good electrical and thermal conductivity (Ensures heat is taken away from the target material). For low temperature applications, Indium works fine while for high temperature applications elastomeric bonding OR copper bonding/plating is the way to go. Please select the bonding option for more information.
SKU: XL-1-1-1-1-1-1-1-1-1 Category:

Additional information

Elements

Antimony Trisulfide (Sb2S3), Arsenic Trisulfide (As2S3), Barium Sulfide (BaS), Bismuth Sulfide (Bi2S3), Cadmium Sulfide (CdS), Cerium Sulfide (Ce2S3), Calcium Sulfide (CaS), Copper Zinc Tin Sulfide (CZTSSe), Chromium Sulfide (Cr2S3), Copper Monosulfide (CuS), Germanium Monosulfide (GeS), Germanium Disulfide (GeS2), Indium Sulfide (In2S3), Iron Sulfide (FeS), Lithium Germanium (LiGe), Lithium Phosphorous Sulfide (Li3PS4), Lithium Sulfide Sputtering (Li2S), Lead Sulfide (PbS), Magnesium Sulfide (MgS), Manganese Sulfide (MnS), Molybdenum Disulfide (MoS2), Niobium Sulfide (NbS), Silicon Disulfide (SiS2), Silver Sulfide (Ag2S), Tantalum Sulfide (TaS2), Tin Sulfide (SnS2), Tungsten Disulfide (WS2), Zinc Sulfide (ZnS)
Purity

99%, 99.5%, 99.9%, 99.99%, 99.999%
Diameter

2”, 3”, 4”, 5”, 6”
Thickness

0.125”, 0.25”
Bonding

Yes, No

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