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Nitride Ceramics ST

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Safety Data SheetDownload SDS

Notes on Bonding
Note Sputter targets can be bonded by Indium Bonding, Copper Backing plates OR Elastomeric Bonding. Metallic bonds enable good electrical and thermal conductivity (Ensures heat is taken away from the target material). For low temperature applications, Indium works fine while for high temperature applications elastomeric bonding OR copper bonding/plating is the way to go. Please select the bonding option for more information.
SKU: XL-1-1-1-1-1 Category:

Additional information

Elements

Aluminum Nitride (AlN), Boron Nitride (BN), Chromium Nitride (Cr2N), Germanium Nitride (Ge3N4), Iron Nitride (FeN4), Hafnium Nitride (HfN), Niobium Nitride (NbN), Silicon Nitride (Si3N4), Tantalum Nitride (TaN), Titanium Nitride (TiN), Vanadium Nitride (VN), Zinc Nitride (Zn3N2), Zirconium Nitride (ZrN), Gallium Nitride (GaN), Europium Nitride (EuN)
Purity

99%, 99.5%, 99.9%, 99.99%, 99.999%
Diameter

2”, 3”, 4”, 5”, 6”
Thickness

0.125”, 0.25”
Bonding

Yes, No

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