Additional information
| Substrate | Customer, MSC |
|---|---|
| Type | Czochralski (CZ), Float Zone (FZ) |
| Diameter | 2”, 3”, 4”, 6”, 8”, 12”, 18” |
| Wafer Type | Si, SiC, Ge, GaAs, GaN, InP, Other |
| Other Wafer | Enter Wafer Type |
| Dopant | Enter Type & Conc. |
| Orientation | 100, 111, 110, Custom |
| Resistivity (ohm-cm | ≤0.005, 0.01 – 0.02, 1-5, 5-10, 10-20, 20-30, 30-100, NA |
| Thickness (um) | 200, 279, 300, 381, 400, 525, 625, 675, 725, NA |
| Flats/Notch | No Flat, SEMI Primary Flat, Jeida Flat, 1 SEMI Flat, 2 SEMI Flats, Notch, NA |
| Finish | SSP, DSP |
| Lasermark | None, SEMI M13 FRONT-SIDE MARK, FRONT SIDE & BACK SIDE MIXED, SEMI M13 BACK-SIDE MARK, NA |
| Deposited Material | SiO2, SiN, HfO2, TiN, ZrO2, Poly-Si, Oxy-Nitride (SiON, Low k – Black Diamond, Low k – Coral, Low k – Spin On, Al, AlCu, AlMg, AlSi, Al2O3, Ag, Au, AlN, A-Si, BPSG, C, Co, Cr, Cr2O3, CrSi, Cu, CuNi, CrMo, Fe, FeCo, Ge, GeSbTe, ITO, Mo, MoSi, Nb, Ni, NiCr, NiFe, NiP, NiSi, NiV, Pd, PSG, SiC, SiCr, Sn, Ta2O5, TaAl, TaN, Ti, TiN, TiW, TiNi, TiSi2, TiO2, W, WN, WSi, WTi, Zr, ZrO2, Other |
| Other Materials: | Enter Material Type |
| Deposition Type | Sputtering, E-beam Evaporation, LPCVD, PECVD, ALD |
| Material Thickness | Enter thickness here |
