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Tantalum Nitride Etchant SIE-8607

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Product Properties
Product Name Tantalum Nitride Etchant SIE-8607
How do I increase the etch rate? 1. The rate will approximately double with every 10°C increase in temperature.
2. Increase the rate of stirring or agitation.
How do I reduce the etch rate? Adding 1 part deionized water to 2 parts etchant will reduce the etch rate approximately 50%.
Do I need to dilute the etchant? No, it is ready to use.
How do I reduce undercutting? Increase the rate of stirring or agitation.
Etch Rate at 25°C 70–80 Å/sec
Storage Conditions Ambient
Filtration 0.2 μm
Recommended Operating Temperatures 20–80°C (30–40°C most common)
Rinse Deionized water
Photoresist Compatibility KLT6000 Series, KLT 5300 Series, HARE SQ (SU-8 type), TRANSIST, or PKP-308PI
Select Compatible Materials Au
Select Incompatible Materials Oxide, nitride, Al, Si
Compatible Plastics HDPE, PP, Teflon, PFA, PVC
Isotropy Isotropic
Additional Information
SDS Download SDS
SKU: N/A Category:

Additional information

Size

1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon