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| Product Properties |
| Description |
- Manual, Semi-automatic & Fully Automatic Versions
- Standard and Vacuum Systems – DC to > 750 GHz
- Applications: Silicon and III-V materials – die, partial wafers, wafers up to 300 mm, frames, MMICS, T/R modules and more.
- Thermal Systems from -60°C to 300°C
- Thin Wafer Material Handling
- Customized Chucks, Carrier Plates, Chip Trays
- Manipulators – large family – manual & programmable
- Non-Contact Height Measurement Sensors
- DC & RF Probe Tips, Probe Cards, Multi-Contact Wedges
- Accessories – calibration substrates, cleaning pads, cables, connectors
- Integrated Solutions – VNAs, Extension Modules and tuners
- Modular PS4L Hardware & Software Architecture
- It is possible to combine features from different probing solutions. Please connect through the request quote form.
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