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| Product Properties |
| Description |
- Manual, Semi-automatic & Fully Automatic Versions
- Single-Sided or Double-Sided
- Die, partial wafers, whole wafers, substrates, PCB, and more
- Solutions for multiple materials and aspects of Device Characterization:
- Electrical – I-V, C-V, frequency, power consumption, signal integrity
- Design Verification – measured results vs design specifications
- Parametric Yield – statistical analysis of measured parameters
- Reliability & Lifetime – temperature cycling, stress testing
- Thermal Systems from -60°C to 400°C
- Shielded Enclosures – Dark Boxes or Localized Environmental Chambers (LEC)
- Manipulators – manual, programmable and hexapods
- Probe Arms – coaxial, triaxial, kelvin, High Frequency, High Power and more
- Probe Tips, Probe Cards, Wedges, Non-Contact Height Measurement Sensors
- Laser Cutters, Integrating Spheres, Packaged Part Holders
- Integrated Solutions with Test Instrumentation – parametric analyzers (Keysight B1500, Keithley 4200), vector network analyzers and more
- Modular PS4L Hardware & Software Architecture
- It is possible to combine features from different probing solutions. Please connect through the request quote form.
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