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K-PRO, Advanced Packaging Thick Positive Photoresist

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Product Properties
Description	K-PRO™ photoresists are advanced packaging positive resists for use in i-line, g-line, and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.
Properties	Cover 5 – 25 µm in a single coat Double-coat process available for up to 50 microns Designed for use with metal-ion or metal-ion free developers No PEB required
Volumes & Customization	Sizes available: 100ml sample, 500ml, 1L, 4L Production volumes available (>20G) Custom thicknesses and formulations are available by request
Data Sheet	Download link

SKU: N/A Category: Advanced Packaging, TSV, Bumping & Plating

Additional information

Additional information

Type	KPRO1, KPRO2, KPRO3, KPRO5, KPRO7, KPRO15
Size	100ml, 500ml, 1L, 4L/1Gal, 4x4L, Production