Additional information
| Size | 1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon |
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| Product Properties | |
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| Description | Transene Copper Etchant 49-1 is a high purity, controllable etchant designed for specific microelectronic etch applications such as gallium arsenide or copper. It is compatible with lead-free solders (100% tin, 97%-tin/3%-silver), as well as gold, nickel, and nickel-vanadium alloys. Copper Etch BTP provides a faster etch rate while maintaining nickel compatibility. |
| How to Increase Etch Rate? | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
| How to Reduce Etch Rate? | Adding 1 part deionized water to 2 parts etchant will reduce the rate by approximately 50%. |
| Do I Need to Dilute? | No, it is ready to use. |
| How to Reduce Undercutting | Increase the rate of stirring or agitation. |
| Appearance | Clear, Colorless |
| pH | 5.9–6.3 |
| Etch Rate at 25°C | 40 Å/sec |
| Shelf Life | 9 months |
| Storage Conditions | Ambient (Refrigeration Preferred) |
| Filtration | 1 µm |
| Recommended Operating Temperatures | 20–80°C (30–40°C most common) |
| Rinse | Deionized water |
| Photoresist Recommendations | KLT6000, KLT5300, HARE SQ (SU-8), TRANSIST, or PKP-308PI |
| Compatible Materials | Au, Ti, oxide, nitride, Si, Ni |
| Incompatible Materials | III-V materials, Zn |
| Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
| Country of Origin | USA |
| Isotropy | Isotropic |
| Incompatible Chemicals | Strong bases |
| Additional Information | Extend bath life by monitoring/maintaining peroxide concentration and pH |
| Safety Data Sheet | Download SDS |
| Size | 1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon |
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