Additional information
| Size | 1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon |
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| Product Properties | |
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| Product Type | Silicon Dioxide Etchant |
| Description | AlPAD Etch 639 is an oxide etchant designed to minimize attack on aluminum pads or other aluminum structures and on silicon surfaces. These oxides are commonly grown or deposited in LPCVD systems. The deposited oxide is often used as a passivation layer over a metallized silicon substrate. The formulation of AlPAD Etch 639 includes a surfactant to ensure wet etch out over high surface energy substrates. |
| Etch Rate | 5000 A / minute @ 22°C |
| Product Contains | Ammonium Fluoride, Glacial Acetic Acid, Glycol, Surfactant, Deionized Water |
| Appearance | Water-white |
| Etch Rate at 22°C | 5,000 Å/min |
| Etch Rate at 40°C | 10,000 Å/min |
| Shelf Life | 1 year |
| pH | Mild acidic |
| Storage Conditions | Ambient |
| Filtration | 0.2 μm |
| Recommended Operating Temperatures | 20–80°C (30–40°C most common) |
| Rinse | Deionized water; alcohol rinse optional |
| Compatible Materials | Aluminum, ceramic, gold, nickel, copper |
| Incompatible Materials | Silica, alumina, silicon nitride |
| Isotropy | Isotropic |
| Particle Count | Learn more |
| Safety Data Sheet | Download SDS |
| Size | 1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon |
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