Additional information
| Size | 1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon |
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| Product Properties | |
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| Description | This solution is used for etching copper, copper alloy, and kovar in thin film and PC circuits. APS-100 Copper Etchant is specially formulated for controlled etching with excellent line definition and compatibility with tin-lead solders, making it suitable for thin film circuit applications. |
| How to Increase Etch Rate | 1. The rate will approximately double with every 10°C increase in temperature. 2. Increase the rate of stirring or agitation. |
| How to Reduce Etch Rate | Add 1 part deionized water to 2 parts etchant to reduce etch rate by ~50%. |
| Do I Need to Dilute? | No, it is ready to use. |
| How to Reduce Undercutting | Increase the rate of stirring or agitation. |
| Appearance | Water-white |
| pH | Acidic |
| Etch Rate at 40°C | 80 Å/sec (etches 1 oz copper in 7.5 minutes) |
| Shelf Life | 6 months |
| Storage Conditions | Ambient |
| Filtration | 1 µm |
| Recommended Operating Temperatures | 20–80°C (30–40°C most common) |
| Rinse | Deionized water |
| Photoresist Recommendations | KLT6000, KLT5300, HARE SQ (SU-8), TRANSIST, or PKP-308PI |
| Compatible Materials | Au, oxide, nitride, alumina |
| Incompatible Materials | Al, Ni |
| Compatible Plastics | HDPE, PP, Teflon, PFA, PVC |
| Country of Origin | USA |
| Isotropy | Isotropic |
| Incompatible Chemicals | Flammables, combustibles, strong bases |
| Additional Information | Immersion or spray application. Vented cap storage |
| Safety Data Sheet | Download SDS |
| Size | 1 Quart, 1 Gallon, 4×1 Gallon, 5 Gallon, 55 Gallon |
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